Contact resistance in carbon nanostructure via interconnects

Electrical Properties of Carbon Nanotube Bundles for Future Via Interconnects

On Contact Resistance of Carbon Nanotubes

Carbon nanotubes (CNTs) have found many potential applications stemming from their small dimensions and marvellous electronic, mechanical, and thermal properties. One of the barriers for using CNTs as building blocks in nanoelectronics is the high contact resistance. This paper reviews recent progress on the research of contact resistance of CNTs. It starts with a preview of two basic contact c...

Design and fabrication of a multilayered polymer microfluidic chip with nanofluidic interconnects via adhesive contact printing.

The design and fabrication of a multilayered polymer micro-nanofluidic chip is described that consists of poly(methylmethacrylate) (PMMA) layers that contain microfluidic channels separated in the vertical direction by polycarbonate (PC) membranes that incorporate an array of nanometre diameter cylindrical pores. The materials are optically transparent to allow inspection of the fluids within t...

Thermal Contact Resistance and Thermal Conductivity of a Carbon Nanofiber

We have measured the thermal resistance of a 152-nm-diameter carbon nanofiber before and after a platinum layer was deposited on the contacts between the nanofiber and the measurement device. The contact resistance was reduced by the platinum coating for about 9–13% of the total thermal resistance of the nanofiber sample before the platinum coating. At a temperature of 300 K, the axial thermal ...

A Thermal Model for Carbon Nanotube Interconnects

In this work, we have studied Joule heating in carbon nanotube based very large scale integration (VLSI) interconnects and incorporated Joule heating influenced scattering in our previously developed current transport model. The theoretical model explains breakdown in carbon nanotube resistance which limits the current density. We have also studied scattering parameters of carbon nanotube (CNT)...